The Intel Xeon Gold 6150 is a stable-demand SKU in our B2B catalogue, frequently ordered in volume by system integrators building LGA 3647 platforms and by resellers servicing legacy datacenter fleets. Units are offered with consistent batch/stepping tracking for multi-unit deployments, ensuring matched silicon across a single purchase order wherever inventory allows.
Stock status is updated daily on our wholesale portal. Confirmed orders are typically allocated from on-hand inventory; for large-volume requirements we can arrange scheduled deliveries in batches aligned with your build or restocking plan. All shipments are packed in ESD-safe, export-grade packaging suitable for international freight.
Every unit ships with a standard B2B warranty and a defined RMA process: defective parts are tested, cross-shipped or credited per our RMA terms, and dedicated account support handles claims end to end. Products comply with CE, FCC and RoHS requirements, and export documentation is provided for cross-border procurement.
We supply IT distributors, VARs, refurbishers and integrators; per-unit pricing scales with order volume, and quotes are prepared per enquiry based on quantity and destination. For current availability, batch details and volume pricing, please request a wholesale quote.
Key specifications (table)
| Parameter | Specification |
|---|---|
| Model | Intel Xeon Gold 6150 |
| Processor Family | Xeon Scalable (Gold 6100 Series) |
| Microarchitecture | Skylake-SP |
| Manufacturing Process | 14 nm |
| Total Cores | 18 |
| Total Threads | 36 |
| Base Clock Frequency | 2.70 GHz |
| Max Turbo Frequency | 3.70 GHz |
| L1 Cache | 18 × 64 KB (instruction + data per core) |
| L2 Cache | 18 × 1 MB = 18 MB |
| L3 Cache | 24.75 MB shared |
| TDP | 165 W (verify server cooling and PSU headroom) |
| Socket | LGA 3647 (platform dependent) |
| Memory Type | DDR4-2666 ECC |
| Memory Channels | 6 |
| Max Memory Capacity | Up to 768 GB per socket (platform dependent) |
| PCI Express Lanes | 48 lanes (PCIe 3.0) |
| UPI Links | 3 links |
| Instruction Set Extensions | SSE4.2, AVX, AVX2, AVX-512 (dual FMA units) |
| Virtualization Support | VT-x, VT-d |
| Security Features | Intel SGX, AES-NI, Boot Guard, TXT |
| Reliability Features (RAS) | Enhanced ECC, memory mirroring, machine check recovery |
| Launch Year | 2017 |
| Typical Deployment | High-density virtualization, HPC clusters, enterprise cloud servers |
Integration Notes for Resellers & Integrators
- Requires an LGA 3647 (Socket P) platform; when quoting to end customers, confirm BIOS support and VRM/cooling compliance with the 165 W TDP on C620-series or equivalent boards.
- Three UPI links enable 2S+ multi-socket builds — a common configuration in enterprise rack and HPC node projects using this SKU.
- As a first-generation Scalable processor, this part is frequently procured for spare-part, maintenance and expansion contracts on installed LGA 3647 fleets; match heatsink and chassis inventory when fulfilling such orders.
Wholesale & Procurement Notes
- MOQ negotiable — flexible quantities for sample orders through bulk contracts.
- Tiered volume pricing available; request a quote with your target quantity.
- Typical lead time: 2–7 business days for in-stock volume; scheduled batch delivery possible for large orders.
- Packing & shipping: ESD-safe clamshell trays, export cartons; air freight, express courier or consolidated sea freight at buyer’s option.
- RMA window: standard 30-day DOA/return window plus product warranty terms; RMAs handled by our B2B support team.
