The Intel Xeon Gold 6312U is a 3rd Generation Xeon Scalable (Ice Lake-SP) processor that we supply in volume to resellers, system integrators, and IT procurement teams building cloud, virtualization, storage, and high-density compute nodes. Its 16 cores / 32 threads and 150 W power-optimized TDP make it a strong candidate for dense 1U/2U server builds. All units ship from a consistent batch with matched stepping/lot options available for dual-socket deployments. Buyers should verify motherboard compatibility (BIOS support, PCIe 4.0, and memory capacity are platform dependent) prior to placing bulk orders.
Key specifications (table)
| Parameter | Specification |
|---|---|
| Model | Intel Xeon Gold 6312U |
| Product family | 3rd Generation Intel Xeon Scalable |
| Architecture | Ice Lake-SP |
| Cores / Threads | 16 / 32 |
| Base frequency | 2.10 GHz |
| Max turbo frequency | 3.30 GHz |
| L3 cache | 24 MB |
| Socket | FCLGA4189 (dual-socket capable) |
| TDP | 150 W (low-power optimized) |
| Memory type | DDR4 ECC |
| Memory speed | Up to DDR4-3200 |
| Memory channels | 8 |
| Maximum memory capacity | Platform dependent |
| PCIe | PCIe 4.0 (platform dependent) |
| Instruction extensions | AVX, AVX2, AVX-512, AES-NI, SSE4.2 |
| Virtualization | Intel VT-x, Intel VT-d |
| Reliability | Enterprise RAS capabilities |
| Recommended use cases | Cloud servers, virtualization nodes, storage servers, distributed computing, enterprise workloads |
Wholesale Supply Information
Stock position: this SKU is maintained in channel inventory with regular replenishment; current on-hand quantities and incoming batch schedules are confirmed at quotation. Batch consistency: for two-socket builds, we can allocate processors from the same lot and stepping on request — please flag this requirement when requesting pricing. Warranty & RMA: units carry a standard channel warranty with a defined DOA/RMA window; failed units are processed through our returns workflow with replacement or credit per our trading terms.
Compliance & export: all shipments are CE, FCC, and RoHS compliant, and export documentation is prepared in accordance with applicable trade regulations. Lead times are typically short for in-stock quantities; larger allocations may require scheduling against incoming inventory. Before confirming an order, integrators are advised to confirm socket (FCLGA4189), chipset, and BIOS compatibility with their board vendor. The U suffix denotes a lower-TDP variant within the Gold tier (between Silver and Platinum), suited to thermally constrained chassis. To request a wholesale quote, include your target quantity, delivery destination, and any batch-matching requirements.
Wholesale & Procurement Notes
- MOQ negotiable depending on SKU availability and destination market.
- Tiered volume pricing available — contact us for a formal quotation.
- Typical lead time: 3–7 business days for in-stock items; scheduled delivery for bulk allocations.
- Packing & shipping: anti-static OEM/tray packing, cartonized for freight; express and consolidated sea/air freight options supported.
- RMA window: 30 days DOA coverage, followed by standard channel warranty terms.
