The Intel Xeon Gold 6342 is a stock item in our catalog for B2B buyers, offering 24 cores and 48 threads on the 3rd Gen Intel Xeon Scalable (Ice Lake-SP) platform. It is a frequently requested SKU among system integrators building virtualization nodes, general-purpose compute servers, and storage/controller appliances, and we supply it to resellers, IT procurement teams, and OEM/ODM assembly houses in single units through to container-scale volumes.
Units are sourced through authorized distribution channels and shipped in consistent, single-batch lots wherever possible, ensuring tray and boxed code uniformity across your deployment or resale inventory. Each order is checked for serial number integrity and export documentation compliance prior to dispatch. The product carries CE, FCC, and RoHS certifications, supporting smooth customs clearance in most destination markets.
Warranty coverage and RMA handling are managed directly through our wholesale desk: defective units reported within the RMA window are replaced or credited under our standard B2B terms, minimizing downtime for integration projects and end-customer commitments. Typical lead times for in-stock quantities range from 2 to 5 business days; larger volume allocations are confirmed at quote stage. For volume pricing, batch availability, or region-specific shipping options, please request a wholesale quote.
Key specifications (table)
| Parameter | Specification |
|---|---|
| Processor Name | Intel Xeon Gold 6342 |
| Architecture | Ice Lake-SP |
| Generation | 3rd Gen Intel Xeon Scalable |
| Manufacturing Process | 10 nm |
| Cores | 24 |
| Threads | 48 |
| Base Frequency | 2.80 GHz |
| Max Turbo Frequency | Up to 3.50 GHz (workload and platform dependent) |
| L3 Cache | 36 MB |
| Socket | LGA 4189 |
| Thermal Design Power (TDP) | 230 W (guidance only — ensure adequate server cooling and power provisioning) |
Integration & Deployment Guidance
- Platform validation: the processor installs only on LGA 4189 motherboards supporting 3rd Gen Xeon Scalable (Ice Lake-SP); integrators should confirm chipset and BIOS compatibility across the target hardware bill of materials before committing to volume orders.
- Portfolio positioning: within the Gold tier of the Ice Lake-SP lineup, the 6342 combines a high core count with a 230 W thermal envelope, slotting above lower-core Gold SKUs and below Platinum parts — useful when standardizing platforms across multiple customer configurations.
- Infrastructure planning: at 230 W TDP, ensure chassis airflow, heatsink selection, and PSU headroom are specified accordingly, and provision all eight memory channels to fully utilize the 24 cores in production deployments.
Wholesale & Procurement Notes
- MOQ negotiable — trial orders and sample quantities accepted from qualified B2B buyers.
- Tiered volume pricing available; contact our sales desk to request a quote.
- Typical lead time: 2–5 business days for stocked quantities; volume allocations confirmed at order.
- Packing & shipping: original tray/boxed packaging, anti-static handling, air or sea freight, DDP/DHL/FedEx options with export documentation.
- RMA window: 30 days DOA coverage plus standard warranty handling via our B2B support channel.
