Huaqiangbei Electronics Sourcing Guide (B2B)

INTEL Xeon 6346 3.10GHz CPU

INTEL Xeon 6346 3.10GHz CPU

SKU: 4432

The Intel Xeon Gold 6346 is a 3rd Generation Intel Xeon Scalable processor (Ice Lake-SP) manufactured on a 10 nm process, delivering 16 cores and 32 threads at a 3.10 GHz base frequency. For channel partners, this SKU is a steady-demand item for dual-socket server builds targeting virtualization hosts, compute clusters, and storage appliances where strong per-core throughput matters. Bulk inventory is held in batch-controlled stock, and we recommend verifying LGA 4189 platform and BIOS support on target motherboards before placing volume orders.

Key specifications (table)

Parameter Specification
CPU Model Intel Xeon Gold 6346
Series 3rd Generation Intel Xeon Scalable
Architecture Ice Lake-SP
Process Technology 10 nm
Socket LGA 4189 (platform dependent — check server board support)
Cores 16 physical cores
Threads 32 simultaneous threads
TDP 205 W (verify chassis cooling provision)
Max Temperature (Tcase) 78 °C
UPI Speed 11.2 GT/s
UPI Links Up to 3

Supply & Channel Information

  • Batch consistency: Volume orders are fulfilled from matched lots with identical stepping and S-Spec wherever possible, simplifying image deployment and fleet management for system integrators and data center builders.
  • Warranty & RMA: Standard B2B warranty coverage with a structured RMA process; defective units are verified, replaced, or credited per agreed terms, minimizing downtime for reseller commitments.
  • Lead times: In-stock quantities ship on short notice; larger call-offs may be scheduled in tranches to align with your project milestones.
  • Export compliance: Units ship with CE, FCC, and RoHS conformity documentation, supporting resale into regulated markets. Buyers are responsible for import compliance in the destination region.
  • Platform note: LGA 4189 (Socket P+) parts are exclusive to Ice Lake-SP platforms such as C620A-series boards and will not fit older Cascade Lake sockets — confirm compatibility with your board vendor before ordering.
  • Thermal planning: The 205 W TDP requires adequate chassis airflow and PSU headroom; we can advise on reference cooling configurations for multi-node rollouts.
  • Positioning: Within the 3rd Gen Xeon Scalable lineup, the Gold 6346 offers a popular balance of 16 high-clock cores versus higher-core-count SKUs, making it a reliable mover for channel inventory.

Wholesale & Procurement Notes

  • MOQ negotiable — trial orders and pilot quantities accepted for new partners.
  • Tiered volume pricing available; request a wholesale quote with your target quantity.
  • Typical lead time: 1–3 business days for stocked items; 1–2 weeks for large or scheduled call-offs.
  • Packing & shipping: anti-static trays, individual retail/tray packaging, consolidated pallet freight, or split shipments to multiple destinations.
  • RMA window: 30 days DOA coverage plus standard warranty terms on confirmed defects.