The Intel Xeon 4309Y (8 cores / 16 threads, 3rd Gen Intel Xeon Scalable, Ice Lake) is a high-turnover SKU for our wholesale catalog, suited to entry and mid-density server builds including virtualization nodes, storage controllers and light compute appliances. We supply this part to resellers, OEM/ODM system integrators and IT procurement teams on a project and stocking basis.
Stock is held in allocation-ready batches; large orders are fulfilled from the same date code and stepping wherever possible to ensure fleet consistency for rollouts and RMA matching. Every unit ships in original Intel packaging with verifiable tray/box integrity. Standard warranty covers 12 months with structured RMA handling — cross-shipment options available for contract buyers after fault verification.
Please confirm that your target platform uses an LGA4189 (Socket P+) motherboard with a C620A-series chipset and current BIOS support before placing volume orders; our sales engineers can assist with platform compatibility checks for bulk configurations. All shipments are CE / FCC / RoHS compliant with full export documentation provided for cross-border procurement.
Key specifications (table)
| Parameter | Specification |
|---|---|
| Product family | Intel Xeon Scalable, 3rd Gen (Ice Lake) |
| Cores / Threads | 8 Cores / 16 Threads |
| Base frequency | 2.80 GHz |
| Max turbo frequency | Up to 3.60 GHz (workload and platform dependent) |
| L3 cache | 12 MB |
| TDP | 105 W (thermal design guidance only) |
| Socket | LGA4189 (Socket P+) |
| Lithography | 10 nm |
| Memory support | DDR4-3200, 8-channel |
| Max memory capacity | Up to 6 TB with Intel Optane Persistent Memory (configuration dependent) |
| PCIe support | PCIe 4.0, 64 lanes |
| Advanced technologies | Intel SGX, DL Boost, AVX-512, Intel Speed Select Technology, Secure Boot |
Sourcing & deployment guidance
- Socket constraint: fits only LGA4189 boards for 3rd Gen Xeon Scalable (Ice Lake-SP); not backward compatible with LGA3647 (1st/2nd Gen) platforms — a key check point when sourcing boards alongside CPU volume.
- Positioning within the 43xx series: entry tier below the 4310; the 105 W TDP makes it attractive for density-optimized and thermally constrained server SKUs your customers may demand.
- Configuration advice for your build sheets: recommend full 8-channel DDR4-3200 population in customer configurations to realize full memory bandwidth in virtualization and storage deployments.
Wholesale & Procurement Notes
- MOQ negotiable depending on stock position and destination market.
- Tiered volume pricing available — contact us to request a wholesale quote.
- Typical lead time: 3–7 business days for in-stock quantities; longer for scheduled batch releases.
- Packing & shipping: original retail/tray packaging, anti-static bulk packing, DHL/FedEx/air freight or consolidated sea freight options.
- RMA window: 12-month warranty with 30-day DOA/return handling for verified defects.
