The Intel Xeon Gold 5317 is a 12-core / 24-thread processor from the 3rd-Generation Intel Xeon Scalable family (Ice Lake-SP), manufactured on a 10 nm process with a 3.00 GHz base clock and up to 3.60 GHz turbo. For our wholesale channel, this SKU is in steady demand among system integrators and resellers building dual-socket virtualization hosts, cloud nodes, storage controllers and edge servers. Stock is held in volume and batches are kept consistent so that units shipped within the same purchase order carry matching stepping and revision — an important consideration for dual-socket deployments and repeat orders.
Key specifications (table)
| Parameter | Specification |
| Model | Intel Xeon Gold 5317 |
| Product Family | 3rd-Generation Intel Xeon Scalable (Ice Lake-SP) |
| Cores / Threads | 12 / 24 |
| Base Frequency | 3.00 GHz |
| Max Turbo Frequency | 3.60 GHz |
| L3 Cache | 18 MB |
| Process Node | 10 nm |
| Socket | FCLGA4189 (LGA 4189) — Ice Lake-SP platform dependent |
| TDP | 150 W — verify server cooling and power provisioning |
| Memory Type | DDR4-2933 (ECC supported) |
| Memory Channels | Up to 8 channels |
| Max Memory per Socket | Up to 6 TB (platform dependent) |
| PCI Express | PCIe 4.0; up to 64 lanes (platform dependent) |
| UPI Links | 3 links, 11.2 GT/s each |
| Max SMP Configuration | Dual-socket (2 CPUs per system) |
| Instruction Set & Extensions | 64-bit ISA; AVX, AVX2, AVX-512, AES-NI, SSE4.2, TSX-NI, etc. |
| Special Features | Intel Deep Learning Boost, Resource Director Technology, Speed Select, ECC memory, VT-x / VT-d virtualization, hardware reliability features |
| Application Areas | Virtualization, cloud servers, mid-range servers, storage controllers, edge servers, enterprise workloads |
Procurement notes
- Platform compatibility: requires an Ice Lake-SP (3rd-Gen Xeon Scalable) motherboard with Socket LGA4189 and matching BIOS support; not compatible with Copper Lake or Cascade Lake (LGA3647) platforms. We advise integrators to confirm platform fit before placing volume orders.
- Batch consistency: units within a single order are supplied from matched lots wherever possible, with stepping/revision documented on request — recommended for dual-socket builds.
- Warranty & RMA: all units ship with a standard dealer warranty; DOA and failure-based returns are handled through our RMA channel with defined processing windows.
- Compliance: shipments are CE / FCC / RoHS compliant and accompanied by commercial export documentation suitable for international procurement.
- Deployment tip: chassis must support 150 W TDP; plan DIMM population across all 8 channels to realize full DDR4-2933 bandwidth.
For resellers, system integrators and IT procurement teams planning volume purchases, our sales team can confirm current stock depth, batch dates and delivery schedules. Typical orders are processed and dispatched within a short lead time, and recurring BOM requirements can be secured with reserved allocations. To discuss pricing for your project, request a wholesale quote.
Wholesale & Procurement Notes
- MOQ negotiable depending on SKU availability and destination.
- Tiered volume pricing — request a quote for your quantity break.
- Typical lead time: 3–7 business days for in-stock items.
- Packing & shipping: anti-static bulk trays, neutral or branded packaging, DHL/FedEx/air freight options.
- RMA window: 30 days DOA / standard dealer warranty thereafter.
