The Intel Xeon Gold 6314U is a 16-core, 32-thread processor based on the 3rd Generation Intel Xeon Scalable platform (Ice Lake-SP), frequently specified by system integrators and data center builders for cloud, virtualization, and storage deployments. Its FCLGA4189 socket supports dual-socket configurations, and with 8-channel DDR4 ECC memory and PCIe 4.0 connectivity it addresses mid-range enterprise workloads including virtualization hosts, storage arrays, and distributed compute nodes. As with any server CPU, memory capacity and PCIe bandwidth depend on the chosen platform — we recommend validating motherboard and BIOS compatibility with your BOM prior to placing a purchase order.
Key specifications (table)
| Parameter | Specification |
| Product Family | 3rd Generation Intel Xeon Scalable |
| Model | Xeon Gold 6314U |
| Cores / Threads | 16 / 32 |
| Architecture | Ice Lake-SP |
| Base Frequency | 2.20 GHz |
| Maximum Turbo Frequency | 3.30 GHz |
| L3 Cache | 24 MB |
| Socket | FCLGA4189 (dual-socket capable) |
| TDP | 150 W |
| Memory Type | DDR4 ECC |
| Memory Speed | Up to DDR4-3200 |
| Memory Channels | 8 |
| Maximum Memory Capacity | Platform dependent |
| PCIe Version | PCIe 4.0 (platform dependent) |
| Instruction Extensions | AVX, AVX2, AVX-512, AES-NI, SSE4.2 |
| Virtualization Support | Intel VT-x, VT-d |
| Reliability Features | Enterprise RAS capabilities |
| Recommended Use Cases | Cloud servers, virtualization nodes, storage servers, enterprise applications, distributed computing |
Sourcing & Supply Information
Stock for this SKU is maintained in batch quantities suitable for volume procurement, and units shipped within a single order are drawn from consistent date codes and steppings wherever possible — an important consideration for integrators building dual-socket systems or maintaining uniform fleet configurations. For dual-socket deployments, we advise ordering matched-pair quantities from the same batch to avoid provisioning discrepancies across sockets.
Each unit ships with our standard wholesale warranty, backed by a structured RMA process for DOA and failure claims. Returned units are tested and replaced or credited according to the agreed warranty terms, minimizing downtime for reseller and integration customers. Lead times for in-stock items are typically short; larger or scheduled deliveries can be planned against our inbound supply pipeline.
All shipments are prepared for export with documentation supporting CE, FCC, and RoHS compliance requirements, making the product suitable for resale and deployment in major regulated markets. Please verify chassis and thermal design accommodate the 150 W TDP, and confirm FCLGA4189 motherboard support for 3rd Gen Xeon Scalable (Ice Lake-SP), including DDR4-3200 and PCIe 4.0 capabilities at the board level. For pricing on volume commitments or to check current availability, request a wholesale quote.
Wholesale & Procurement Notes
- MOQ negotiable depending on stock position and delivery schedule.
- Tiered volume pricing available — contact us with your target quantity for a quote.
- Typical lead time: 1–3 business days for in-stock items; larger orders scheduled by agreement.
- Packing options include bulk/anti-static trays and retail-boxed units; shipping via air, express, or consolidated freight with export documentation.
- Standard RMA window applies — DOA units accepted for replacement or credit under warranty terms.
